电子与封装2024，Vol.24Issue(5)：14-24,11.DOI:10.16257/j.cnki.1681-1070.2024.0059
高功率半导体用纳米银焊膏的研究现状
Research Status of Nano Silver Solder Paste for High-Power Semiconductors
摘要
Abstract
With third-generation semiconductors as core components,more compact,high-frequency,and high-power electronic devices have shown widespread application potential in fields such as radio frequency and microwave electronics,energy conversion and storage,radar and communications.However,high-performance electronic devices require stricter requirements for the electrical conductivity and thermal conductivity of their packaging materials,and mechanical properties of the joints.Nano silver paste has attracted widespread attention due to its excellent low-temperature sintering performance and excellent performance in high-temperature environments.However,the quality of domestic silver powder and silver paste products is relatively low,and the research and development process lack theoretical guidance and must rely on imported materials.Based on the nano silver paste used in high-power semiconductors,the synthesis of nano silver powder using liquid phase chemical reduction method is reviewed,the sintering mechanism of nano silver paste and the factors affecting its performance and controllable methods are studied,which are expected to provide useful guidance and support for the research and production of nano silver paste in China.关键词
纳米银粉/纳米银焊膏/剪切强度/热导率Key words
nano silver powder/nano silver paste/shear strength/thermal conductivity分类
矿业与冶金引用本文复制引用
张宸赫,李盼桢,董浩楠,陈柏杉,黄哲,唐思危,马运柱,刘文胜..高功率半导体用纳米银焊膏的研究现状[J].电子与封装,2024,24(5):14-24,11.基金项目
装备发展部领域基金预研项目(61409220415) （61409220415）
湖南省自然科学基金(2019JJ50813) （2019JJ50813）
