电子与封装2024，Vol.24Issue(5)：25-28,4.DOI:10.16257/j.cnki.1681-1070.2024.0062
首次选用的典型裸芯片应用可靠性评价方法
Application Reliability Evaluation Method for First Selection of Typical Bare Chip
武荣荣 1梅亮 1任翔 1曹阳 1庞明奇 1刘净月1
作者信息
- 1. 航天科工防御技术研究试验中心,北京 100039
- 折叠
摘要
Abstract
Restricted by size and weight of the equipment,under equipment demand of multi-function,high precision and high reliability,the equipment begins to use bare chips instead of packaged devices.The direct application of bare chips without packaging has brought partly cost reduction,but the bare chips without packaging protection have put forward higher requirements for quality and reliability.At the time of the first selection,based on the risk analysis of the reliability of the bare chip application,the reliability evaluation project is designed,the evaluation program is completed,the function/performance,reliability and adaptability of the bare chips are evaluated and mapped.The application reliability evaluation method based on risk analysis can effectively avoid the device application with quality risk or reliability not meeting the requirements.关键词
裸芯片/首次选用/应用可靠性/评价Key words
bare chip/first selection/application reliability/evaluation分类
信息技术与安全科学引用本文复制引用
武荣荣,梅亮,任翔,曹阳,庞明奇,刘净月..首次选用的典型裸芯片应用可靠性评价方法[J].电子与封装,2024,24(5):25-28,4.
