电子与封装2024，Vol.24Issue(5)：37-41,5.DOI:10.16257/j.cnki.1681-1070.2024.0101
回流焊工艺对SMT器件热翘曲的影响
Effect of Reflow Soldering Process on Thermal Warpage of SMT Devices
吕贤亮 1杨迪 1毕明浩 1时慧1
作者信息
- 1. 中国电子技术标准化研究院,北京 100176
- 折叠
摘要
Abstract
Integrated circuits are developing in the direction of miniaturization and high integration,and the reflow soldering process has become a key technology in their assembly process.Integrated circuits are prone to thermal warpage in the reflow soldering process.The thermal warpage of PBGA1296 and PBGA1024 devices under reflow soldering processes with different reflow soldering temperatures and rise and fall temperature rates,is measured using the shadow cloud method,and the experimental results are analyzed by modelling simulation on this basis.The results show that the thermal warpage of BGA devices using surface mount technology(SMT)will increase with the reflow soldering temperature,and the fast reflow rise and fall temperature rate can also lead to severe thermal warpage.The experimental results are highly consistent with the simulation results,which in turn verifies the accuracy and validity of the simulation model.The method of experiments combined with finite element analysis provides a reference for improving the thermal waipage of integrated circuits.关键词
封装技术/回流焊/SMT器件/热翘曲Key words
packaging technology/reflow soldering/SMT device/thermal warpage分类
信息技术与安全科学引用本文复制引用
吕贤亮,杨迪,毕明浩,时慧..回流焊工艺对SMT器件热翘曲的影响[J].电子与封装,2024,24(5):37-41,5.
