制冷学报2024，Vol.45Issue(3)：1-22,49,23.DOI:10.3969/j.issn.0253-4339.2024.03.001
基于平板热管技术的电子器件热管理研究进展
Research Progress on Thermal Management of Electronic Devices Based on Flat Heat Pipe Technology
摘要
Abstract
With the continued miniaturization and high integration of electronic devices,the challenge of heat dissipation caused by the excessive power consumption of electronic devices needs to be resolved urgently.An effective thermal management solution is proposed for heat dissipation in high-power electronic devices using flat heat pipes with excellent temperature uniformity and high heat dissipation efficiency.However,with the increasingly diverse heat dissipation requirements,the creation of an efficient flat heat pipe to suit the heat dissipation demands of emerging electronic equipment remains an important research topic.Therefore,based on expounding the working principle and structural characteristics of the flat heat pipes,the heat transfer performance of the flat heat pipe,the factors that affect the heat transfer performance(capillary wick structure,cavity thickness,working medium,liquid filling rate,inclination angle,and heat source),the measures to strengthen the heat transfer performance of the flat heat pipe(different wettability surfaces and support column structure,etc.),and its application in miniature electronic equipment(IGBT,LED and battery pack)are systematically reviewed.By evaluating the internal flow and heat transfer characteristics of flat heat pipes under different capillary wick structures and cavity thicknesses,the mechanism and comprehensive optimization method of heat dissipation performance,and the design of a flat heat pipe with strong space adaptability and high heat dissipation performance compatible to different electronic device heat management requirements are still key technologies to be further developed.A valuable reference is provided for further research and optimization of flat heat pipes in cooling electronic devices.关键词
平板热管/临界热流密度/表面润湿性/强化传热/电子器件散热Key words
flat heat pipe/critical heat flux/surface wettability/enhanced heat transfer/heat dissipation of electronic devices分类
能源科技引用本文复制引用
罗松,严昱昊,叶恭然,朱剑杰,欧阳洪生,肖隆湟,韩晓红..基于平板热管技术的电子器件热管理研究进展[J].制冷学报,2024,45(3):1-22,49,23.基金项目
国家自然科学基金(52076185)资助项目.(The project was supported by the National Natural Science Foundation of China(No.52076185).) 本文受浙江省自然科学基金(LZ19E060001)项目资助.(The project was supported by the Zhejiang Provincial Natural Science Foundation(No.LZ19E060001).) （52076185）
