电子与封装2024，Vol.24Issue(6)：50-60,11.DOI:10.16257/j.cnki.1681-1070.2024.0119
硅转接板制造与集成技术综述
Review of Silicon Interposer Fabrication and Integration Technology
徐成 1樊嘉祺 1张宏伟 1王华 1陈天放 1刘丰满2
作者信息
- 1. 华进半导体封装先导技术研发中心有限公司,江苏无锡 214142
- 2. 华进半导体封装先导技术研发中心有限公司,江苏无锡 214142||中国科学院微电子研究所,北京 100029
- 折叠
摘要
Abstract
As the development of integrated circuit process slows down,advanced packaging technology with high density,high integration and high-speed interconnection has become the key to improve chip performance.Silicon interposer provides the shortest interconnection in three-dimensional direction and the high-speed interconnection between chips,and it is the mainstream packaging technology for high performance computing and artificial intelligence applications.The development status and technical difficulties of silicon interposer technology are systematically described from the silicon interposer design,manufacturing and 2.5D/3D integration,and the related key process technologies are introduced in detail.关键词
先进封装/硅转接板/硅通孔/三维集成Key words
advanced packaging/silicon interposer/through silicon via/three-dimension integration分类
信息技术与安全科学引用本文复制引用
徐成,樊嘉祺,张宏伟,王华,陈天放,刘丰满..硅转接板制造与集成技术综述[J].电子与封装,2024,24(6):50-60,11.
