电子与封装2024，Vol.24Issue(6)：61-70,10.DOI:10.16257/j.cnki.1681-1070.2024.0149
三维集成电路先进封装中聚合物基材料的研究进展
Research Progress of Polymer-Based Materials for Advanced Packaging of 3D Integrated Circuits
摘要
Abstract
The rapid development of artificial intelligence,big data,the Internet of Things,and wearable devices has greatly spurred the demand for high-end chips.With the development of Moore's Law slowing down,dimensional miniaturization technology has caused chips to encounter many problems such as failure of physical nodes,failure of the law of economics,and insufficient performance,power consumption and area indicators.As an important track for extending and expanding Moore's Law,three-dimensional advanced packaging technology has become a significant driving force for the convergence of high-end chips towards multi-functionalization and product diversification.Alongside the rapid development of advanced packaging technology,higher requirements are placed on the corrosion resistance,electrical,chemical,and mechanical properties of polymer-based key packaging materials.Addressing the advanced packaging process requirements for 3D integrated circuits,the research progress and application status of different polymer-based key materials are discussed,the challenges and opportunities faced by different polymer-based materials are clarified,corresponding solutions are proposed,and future research directions are envisioned.关键词
先进封装/三维封装/聚合物/临时键合Key words
advanced packaging/3D packaging/polymer/temporary bonding分类
信息技术与安全科学引用本文复制引用
范泽域,王方成,刘强,黄明起,叶振文,张国平,孙蓉..三维集成电路先进封装中聚合物基材料的研究进展[J].电子与封装,2024,24(6):61-70,10.基金项目
国家自然科学基金(62174170) （62174170）
广东省自然科学基金(2024A1515010123) （2024A1515010123）
广东省重点领域研发计划(2020B010180001) （2020B010180001）
深圳市科技重大专项(KJZD20230923114708018,KJZD20230923114710022) （KJZD20230923114708018,KJZD20230923114710022）
中国科学院战略性先导科技专项(XDB0670000) （XDB0670000）
