电子与封装2024，Vol.24Issue(6)：71-82,12.DOI:10.16257/j.cnki.1681-1070.2024.0145
集成硅基转接板的PDN供电分析
Analysis of PDN Power Supply for Integrated Silicon-Based Interposers
摘要
Abstract
2.5D/3D packaging with integrated silicon-based interposers is an important packaging solution to enable Chiplet technology.The power supply mechanism of traditional power delivery network(PDN)is summarized,power integrity problems such as excessive DC voltage drop and high path resistance of PDN in advanced packages are analyzed,and equivalent circuit modelling methods for PDN on silicon-based interposers are introduced,with a focus on outlining the modelling and optimization of PDN in 2.5D/3D packages.Power supply noise is reduced by splitting the entire large-area silicon bridge into multiple small silicon bridges,integrating silicon bridges with through silicon vias(TSVs),and increasing the number of TSVs.Finally,comparing the PDN performance of DC-DC power management modules using different integration schemes.The results show that the on-chip integration scheme outperforms the traditional substrate integration scheme in terms of AC impedance,power supply noise,and DC voltage drop,making it a promising power supply solution for 3D Chiplet.关键词
2.5D/3D封装/芯粒/电源分配网络/硅通孔Key words
2.5D/3D package/Chiplet/power delivery network/through silicon via分类
信息技术与安全科学引用本文复制引用
何慧敏,廖成意,刘丰满,戴风伟,曹睿..集成硅基转接板的PDN供电分析[J].电子与封装,2024,24(6):71-82,12.基金项目
基于单光子成像的高集成感存算一体芯片研发与示范应用(Z221100007722028) （Z221100007722028）
