电子与封装2024，Vol.24Issue(6)：97-110,14.DOI:10.16257/j.cnki.1681-1070.2024.0124
基于硅通孔互连的芯粒集成技术研究进展
Research Progress of Chiplet Integration Technology Based on Through Silicon Via Interconnection
张爱兵 1李洋 1姚昕 1李轶楠 1梁梦楠1
作者信息
- 1. 无锡中微高科电子有限公司,江苏无锡 214035
- 折叠
摘要
Abstract
Realizing multi-functional,high-density and miniaturized integration of heterogeneous Chiplets with different functions and process nodes through advanced packaging technology is one of the effective solutions to continue Moore's Law.Among the various types of advanced packaging solutions,2.5D/3D packaging integration based on through silicon via(TSV)technology has a number of performance advantages,such as extremely small product size,extremely short interconnect path and excellent product performance.The application classification of TSV technology is introduced.The typical advanced integration technologies based on TSV interconnection in the industry are summarized and analyzed,and their process flow and process difficulties are introduced.The development trend of this type of advanced packaging technology is prospected.关键词
硅通孔/先进封装/芯粒/异构集成/2.5D封装/3D封装Key words
through silicon via/advanced packaging/Chiplet/heterogeneous integration/2.5D packaging/3D packaging分类
信息技术与安全科学引用本文复制引用
张爱兵,李洋,姚昕,李轶楠,梁梦楠..基于硅通孔互连的芯粒集成技术研究进展[J].电子与封装,2024,24(6):97-110,14.
