电子与封装2024，Vol.24Issue(6)：139-151,13.DOI:10.16257/j.cnki.1681-1070.2024.0079
无凸点混合键合三维集成技术研究进展
Advances in Bumpless Hybrid Bonding for 3D Integration Techniques
摘要
Abstract
In the digital economy era,high-density,low-latency,and multi-functional chips are the cornerstone of high-performance computing requirements and applications such as artificial intelligence,large model training,and Internet of Things.Wire bonding and flip chip bonding with solder balls have problems such as large parasitic capacitance,high power consumption,and large size,etc.,which make traditional packaging methods difficult to meet the requirements of narrow pitch,low power consumption,and small size.The bumpless hybrid bonding technology can achieve interconnection with extremely narrow pitch,effectively avoiding short-circuiting between the bumps of flip chip bonding,reducing parasitic capacitance,package size and power consumption,and meeting the requirements of high-performance computing for high bandwidth and multi-functionality.The materials,bonding processes and methods adopted by the bumpless hybrid bonding technology,and current applications in 3D integration are introduced,and the development trend is prospected.关键词
混合键合/高密度互连/三维集成/先进封装Key words
hybrid bonding/high-density interconnect/3D integration/advanced packaging分类
信息技术与安全科学引用本文复制引用
戚晓芸,马岩,杜玉,王晨曦..无凸点混合键合三维集成技术研究进展[J].电子与封装,2024,24(6):139-151,13.基金项目
国家自然科学基金重大研究计划(92164105) （92164105）
国家自然科学基金面上项目(51975151) （51975151）
黑龙江省头雁团队(HITTY-20190013) （HITTY-20190013）
