电子与封装2024，Vol.24Issue(6)：1-13,13.DOI:10.16257/j.cnki.1681-1070.2024.0102
面向Chiplet集成的三维互连硅桥技术
3D Interconnect Silicon Bridge Technology for Chiplet Integration
摘要
Abstract
Slowdown of Moore's Law and the trend towards diversification in IC product applications have combined to drive the rapid development of advanced packaging technology.Advanced interconnect technology is the core of advanced packaging,and it shows significant advantages in high-speed,high-frequency transmission,power consumption,ultra-fine pinch interconnect as well as the ability of system integration capability.As an important solution for Chiplet and heterogeneous integrated packaging,silicon bridge technology can achieve local high-density interconnections among multiple chips at low cost,and it is widely used in processors,memories,and radio frequency devices.The mainstream silicon bridge technologies in the industry are introduced,and the structural features and key technologies of silicon bridge technologies are analyzed and summarized.Meanwhile,the development trends and challenges of silicon bridge technology are discussed in depth to provide reference for further development in related fields.关键词
先进互连技术/Chiplet/硅桥技术/高密度互连Key words
advanced interconnect technology/Chiplet/silicon bridge technology/high-density interconnection分类
信息技术与安全科学引用本文复制引用
赵瑾,于大全,秦飞..面向Chiplet集成的三维互连硅桥技术[J].电子与封装,2024,24(6):1-13,13.基金项目
国家自然科学基金联合基金(U2241222) （U2241222）
