电子与封装2024，Vol.24Issue(6)：14-19,6.DOI:10.16257/j.cnki.1681-1070.2024.0105
2.5D TSV转接板无损检测方法的研究
Research on Non-Destructive Inspection Method of 2.5D TSV Interposers
张旋 1李海娟 1吴道伟 1张雷1
作者信息
- 1. 中国航天科技集团有限公司第九研究院第七七一研究所,西安 710600
- 折叠
摘要
Abstract
Using silicon through via(TSV)as the core technology to package 3D integrated circuits with silicon interposers can effectively shorten the interconnection length of devices.TSV interposers are widely used in microelectronics,but relatively little research has been done on inspection technology during their process preparation.The inspection of TSV interposers is critical for evaluating their yield rate and application reliability.Therefore,seven non-destructive inspection technologies are summarized,the basic principles,advantages and disadvantages of the non-destructive inspection technologies are discussed,and a systematic evaluation method for non-destructive inspection of 2.5D TSV interposers is formed.The method not only provides support for the research and development of 2.5D micro-module products,but also meets the typical application requirements of 3D package.关键词
封装技术/TSV转接板/无损检测Key words
packaging technology/TSV interposer/non-destructive inspection分类
信息技术与安全科学引用本文复制引用
张旋,李海娟,吴道伟,张雷..2.5D TSV转接板无损检测方法的研究[J].电子与封装,2024,24(6):14-19,6.
