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W-Cu梯度复合材料的制备、组织与性能OA北大核心CSTPCD

Fabrication,microstructure,and properties of W-Cu graded composites

中文摘要英文摘要

采用不同配比的W粉和Cu粉为原料,经过混粉、放电等离子烧结后制备了三层的W-Cu梯度复合材料,研究了不同烧结温度下W-Cu梯度复合材料的微观组织、界面特征、物理性能、力学性能及抗热震性能.结果表明:900 ℃烧结制备W-Cu梯度复合材料相对密度高(95%)且保持了单层的原始设计成分;每个梯度层中W、Cu分布较均匀,W、Cu之间界面结合良好,未发生扩散.W-Cu梯度复合材料的力学性能呈梯度分布,W-40Cu层的显微硬度最高为HV136.在压缩过程中,W-40Cu层首先发生断裂,最高压缩屈服强度为332 MPa.900 ℃烧结制备的W-Cu梯度复合材料的热导率为202 W·m-1·K-1.经抗热震实验后,梯度复合材料界面处无裂纹,具有良好的抗热震性能.

The three-layer W-Cu graded composites were prepared by powders mixing and spark plasma sintering,using W and Cu powders in different proportions as the raw materials.The microstructure,interface characteristics,physical properties,mechanical properties,and thermal shock resistance of the W-Cu graded composites at different sintering temperatures were investigated.The results show that,the W-Cu graded composites sintered at 900 ℃ have the high relative density(95%)and retain the original design composition of single layer.The distribution of W and Cu in each graded layer is uniform,and the interface between W and Cu is well combined without diffusion.The mechanical properties of the W-Cu graded composites show the gradient distribution,and the microhardness of the W-40Cu layer is up to HV 136.The fracture is firstly present at the W-40Cu layer in the compression process,and the highest compressive yield strength is 378 MPa.The thermal conductivity of the W-Cu graded composite sintered at 900 ℃ is 202 W·m-1·K-1.After the thermal shock resistance test,the W-Cu gradient composites show the good thermal shock resistance performance without no crack at the interface.

冯晓伟;司岸恒;冯波;李达人

广东省科学院新材料研究所,广东省金属强韧化技术与应用重点实验室,广州 510650河南科技大学金属材料磨损控制与成型技术国家地方联合工程研究中心,洛阳 471003哈特三维(中山)金属材料有限公司,中山 528403

冶金工业

梯度复合材料放电等离子烧结微观组织界面特征力学性能

graded compositesspark plasma sinteringmicrostructureinterface characteristicsmechanical properties

《粉末冶金技术》 2024 (003)

283-289 / 7

广东省科学院青年人才专项(2023GDASONRC-0321、2023GDASONRC-0210);广东省基础与应用基础重大项目(2020B0301030006);广东省科学院建设国内一流研究机构行动专项资金项目(2020GDASYL-20200101001、2024GDASZH-2024010102、2020GDASYL-20200503001-04).

10.19591/j.cnki.cn11-1974/tf.2022020002

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