电子与封装2024，Vol.24Issue(7)：1-7,7.DOI:10.16257/j.cnki.1681-1070.2024.0076
镀银板表面粗糙度对纳米银焊膏快速烧结互连质量的影响
Effect of Surface Roughness of Silver-Plated Plates on the Quality of Rapidly Sintered Interconnections with Nano Silver Solder Paste
李志豪 1汪松英 2洪少健 2孙啸寒 3曾世堂 1杜昆2
作者信息
- 1. 广州汉源微电子封装材料有限公司,广州 510663
- 2. 广州汉源新材料股份有限公司,广州 510663
- 3. 天津工业大学电气工程学院,天津 300387
- 折叠
摘要
Abstract
By applying the pressure of 15 MPa,the sintered silver connection layer is prepared using the sandwich structure assembled by nano silver solder paste printed on the surface of the prefabricated silver-plated plate under an air atmosphere of 265 ℃.The effect of surface roughness of three types of copper silver-plated plate on the bonding strength at the interface of sintered silver connection is studied.The research results show that the sintered time is 8 min,the arithmetic average surface roughness of the silver-plated plate is 1.630 μm,and the maximum roughness depth is 12.030 μm,which can effectively promote the formation of high-strength metallurgical connection and mechanical interlocking between sintered silver connection layer surface and the substrate surface.In the end,the high shear strength of 61.09 MPa is obtained,indicating that the bonding strength between sintered silver layer and the sintered interface is greatly improved.The research results can provide experimental basis for selecting suitable substrate roughness,thereby obtaining high-strength and highly reliabie low-temperature and rapidly sintered silver interconnect joints.关键词
纳米银焊膏/剪切强度/表面粗糙度/加压烧结/机械联锁Key words
nano silver solder paste/shear strength/surface roughness/pressurized sintering/mechanical interlocking分类
矿业与冶金引用本文复制引用
李志豪,汪松英,洪少健,孙啸寒,曾世堂,杜昆..镀银板表面粗糙度对纳米银焊膏快速烧结互连质量的影响[J].电子与封装,2024,24(7):1-7,7.
