电子与封装2024，Vol.24Issue(7)：29-35,7.DOI:10.16257/j.cnki.1681-1070.2024.0078
高温服役电子元器件的焊接工艺研究
Research on Soldering Process of Electronic Components in High-Temperature Service
摘要
Abstract
In the fields of aerospace,steel metallurgy and geological exploration,some equipment needs to be used in a high-temperature environment.The tolerable temperature of current common assembly structures is generally lower than 200 ℃,or even lower than 150 ℃,which seriously restricts the electronic process of relevant high-temperature service equipment.In order to explore the feasibility of high-temperature soldering of components,the high-temperature soldering process is deeply analyzed.The results show that the solid-liquid phase line temperatures of lead-based high-temperature solder(SnAg2.5Pb96.5)are higher than 250 ℃,the average tensile force of SnAg2.5Pb96.5 solder joints is 139 N,and the average shear force is 237 N.Compared with common lead-free solder(SAC305),SnAg2.5Pb96.5 has a higher solid-liquid phase line temperature,but its tensile force and shear force are reduced.Compared with the direct soldering process,the solder joints obtained by the preheating soldering process have good wettability,and the ceramic capacitors have no cracks.Therefore,the preheating soldering process is more suitable for high-temperature service components.关键词
封装技术/高温服役/高温焊接/装联结构Key words
packaging technology/high-temperature service/high-temperature soldering/assembly structure分类
信息技术与安全科学引用本文复制引用
周阳磊,吕海强,何日吉,周舟..高温服役电子元器件的焊接工艺研究[J].电子与封装,2024,24(7):29-35,7.基金项目
工业和信息化部民用飞机专项科研技术研究-质量和可靠性保证体系研究项目(MJZ2-3N21) （MJZ2-3N21）
