电子与封装2024，Vol.24Issue(7)：50-56,7.DOI:10.16257/j.cnki.1681-1070.2024.0085
倒装芯片的底部填充工艺研究
Research on Underfill Process of Flip Chip
李圣贤 1丁增千1
作者信息
- 1. 材料科学姑苏实验室,江苏苏州 215123
- 折叠
摘要
Abstract
Flip chip technology is widely used in the field of advanced package technology,which can effectively solve the reliability problem caused by stress mismatch between the chip and the substrate.By filling the gap between the chip and the substrate with organic adhesive,the underfill process allows the stress to be redistributed,and thus plays a role in protecting the solder joint and improves the reliability of the package.With the continuous development of the chip to the trend of thin and light,the reduction of chip size and refinement of structure have led to increasing requirements for the filling material performance and package reliability,and the underfill process is facing greater challenges.Measures such as material design and process optimization are effective ways to deal with potential challenges.关键词
封装技术/倒装芯片/底部填充工艺Key words
package technology/flip chip/underfill process分类
信息技术与安全科学引用本文复制引用
李圣贤,丁增千..倒装芯片的底部填充工艺研究[J].电子与封装,2024,24(7):50-56,7.
