电子与封装2024，Vol.24Issue(7)：85-89,5.DOI:10.16257/j.cnki.1681-1070.2024.0073
大尺寸厚层硅外延片表面滑移线缺陷检验研究
Study on Defect Inspection of Surface Slip Line on Large-Size Thick-Layer Silicon Epitaxial Wafers
葛华 1王银海 1杨帆 1尤晓杰1
作者信息
- 1. 南京国盛电子有限公司,南京 211100
- 折叠
摘要
Abstract
At present,the main factor restricting the high-quality production of large-size thick-layer silicon epitaxial products is the surface slip line,and the process control of the slip line heavily relies on the complete and accurate inspection and identification of the slip line.By studying the characterization methods of slip lines with different macro-expression,the error sources of various inspections are compared,the main factors affecting the quantitative calculation of silicon epitaxial slip lines are analyzed,and a scientific and reasonable inspection strategy is formulated to improve the accuracy and stability of slip line inspection in the process of mass production,which has achieved remarkable results.关键词
滑移线/检验误差/量化计算Key words
slip line/inspection error/quantitative calculation分类
信息技术与安全科学引用本文复制引用
葛华,王银海,杨帆,尤晓杰..大尺寸厚层硅外延片表面滑移线缺陷检验研究[J].电子与封装,2024,24(7):85-89,5.
