电子元件与材料2024，Vol.43Issue(6)：678-684,7.DOI:10.14106/j.cnki.1001-2028.2024.1242
基于有限元分析的高性能耐高温导电胶的制备及性能研究
Preparation and properties of high-performance high-temperature conductive adhesive based on finite element analysis
薛晓倩 1石宇皓 1林铁松 1王策 2赵雨微1
作者信息
- 1. 哈尔滨工业大学 先进焊接与连接国家重点实验室,黑龙江 哈尔滨 150001
- 2. 哈尔滨工业大学 先进焊接与连接国家重点实验室,黑龙江 哈尔滨 150001||哈工大郑州研究院,河南 郑州 450018
- 折叠
摘要
Abstract
To address the bottleneck of conductive adhesive matrix for heat intolerance,cyanate ester was selected as the matrix for their high-temperature resistance,low moisture absorption rate,and good thermal stability.And silver was used as the conductive filler.Using APP developer function in COMSOL finite element simulation software,code was imported for randomly distributed conductive particle to establish simulation model,and the shape and size effect of conductive filler particles were explored in more detail for the new conductive adhesive.Compared with silver spheres,the simulated conductivity is better for silver sheet filled conductive adhesive.When the mass fraction of silver reaches 90%,the resistivity of silver sheet filled conductive adhesive is 3 orders of magnitude lower than that of silver sphere filled conductive adhesive.According to simulation results,silver flakes filled conductive adhesive was prepared using flake silver powders as filler,bismaleimide as tougheners,and dibutyltin dilaurate as acuring agent.The resistivity is gradually reduced at higher silver sheet content,which then rapidly drops to 43.9 mΩ·cm and becomes plateau at filler mass fraction of 50%-60%.The conductive adhesive has shear strength of above 15 MPa and can withstand high temperature of 300℃.关键词
导电胶/耐高温/COMSOL/氰酸酯/银Key words
conductive adhesive/high temperature resistance/COMSOL/cyanates/silver分类
化学化工引用本文复制引用
薛晓倩,石宇皓,林铁松,王策,赵雨微..基于有限元分析的高性能耐高温导电胶的制备及性能研究[J].电子元件与材料,2024,43(6):678-684,7.
