电子元件与材料2024，Vol.43Issue(6)：685-693,9.DOI:10.14106/j.cnki.1001-2028.2024.1433
Ga元素对低银系Sn-0.3Ag-0.7Cu焊料合金性能的影响
Effect of Ga element on the properties of low silver Sn-0.3Ag-0.7Cu solder alloy
摘要
Abstract
Ga element was introduced into solder material to improve the comprehensive performance of SAC0307 solder alloy.The effects of Ga addition on the comprehensive performance of Sn-0.3Ag-0.7Cu-xGa(x=0,0.2%,0.4%,0.6%,0.8%,1.0%)solder alloys were investigated by DSC,wetting and spreading experiments,tensile tests,SEM,EDS and XRD.The results show that Ga element has trivial effect on the melting temperature and melting range of the low silver Sn-0.3Ag-0.7Cu-xGa solder alloy.At Ga mass fraction of 0.6%,the wettability of the solder alloy is improved obviously,and the spreading rate of the solder alloy can reach up to 67.55%,and the tensile strength can reach up to 40.18 MPa.The improvement could be attributed to the transformation of the microstructure of the intermetallic compound from long strip to elongated strip and the better refinement of the grain size.The optimal antioxidant performance of the solder alloy can be obtained at the Ga element mass fraction of 0.8%with weight gain ratio of 0.21%,which is roughly equivalent to that of 0.6%.Therefore,Sn-0.3Ag-0.7Cu-xGa(x=0.6%)is the optimum solder alloy according to the comprehensive performance.关键词
焊料合金/熔化特性/润湿性/微观组织/力学性能/抗氧化性Key words
Solder alloys/melting characteristics/wettability/microstructure/mechanical properties/oxidation resistance分类
矿业与冶金引用本文复制引用
徐深深,徐冬霞,郑越,任鹏凯,范晓杰,张红霞..Ga元素对低银系Sn-0.3Ag-0.7Cu焊料合金性能的影响[J].电子元件与材料,2024,43(6):685-693,9.基金项目
河南省产学研合作项目(152107000077) （152107000077）
河南省高校基本科研业务费专项资金资助(NSFRF200404) （NSFRF200404）
贵州省教育厅青年科技人才成长项目(黔教合KY字[2020]160) （黔教合KY字[2020]160）
