Ga元素对低银系Sn-0.3Ag-0.7Cu焊料合金性能的影响OA北大核心CSTPCD

Ga element was introduced into solder material to improve the comprehensive performance of SAC0307 solder alloy.The effects of Ga addition on the comprehensive performance of Sn-0.3Ag-0.7Cu-xGa(x=0,0.2%,0.4%,0.6%,0.8%,1.0%)solder alloys were investigated by DSC,wetting and spreading experiments,tensile tests,SEM,EDS and XRD.The results show that Ga element has trivial effect on the melting temperature and melting range of the low silver Sn-0.3Ag-0.7Cu-xGa solder alloy.At Ga mass fraction of 0.6%,the wettability of the solder alloy is improved obviously,and the spreading rate of the solder alloy can reach up to 67.55%,and the tensile strength can reach up to 40.18 MPa.The improvement could be attributed to the transformation of the microstructure of the intermetallic compound from long strip to elongated strip and the better refinement of the grain size.The optimal antioxidant performance of the solder alloy can be obtained at the Ga element mass fraction of 0.8%with weight gain ratio of 0.21%,which is roughly equivalent to that of 0.6%.Therefore,Sn-0.3Ag-0.7Cu-xGa(x=0.6%)is the optimum solder alloy according to the comprehensive performance.