基于VCCT理论的芯片多顶针剥离工艺参数优化OA北大核心CSTPCD

In order to prevent the chips from chipping during pickup,the virtual crack closure method was used to dynamically model and simulate the process of picking up chips in the multi-ejector pin process.First,the chip-adhesive layer-blue film composite model structure was established.Then the key parameters of the model were determined through the silicon wafer-blue film tensile experiments.Finally,the stress variation on the chip during the peeling process were analyzed by simulating different process parameters,including ejector pin spacing and adhesive layer materials.The simulation results indicate that the concentration of the stress occurs in the central area of the chip during peeling.Reducing the distance between ejector pins and the critical fracture energy of the adhesive layer can alleviate the stress concentration.The results provide the reference for the parameter selection of the multi-ejector pin pick-up chip process,which is helpful to improve the reliability of chip pick-up.