电子元件与材料2024，Vol.43Issue(6)：694-700,707,8.DOI:10.14106/j.cnki.1001-2028.2024.0095
基于VCCT理论的芯片多顶针剥离工艺参数优化
Optimization of chip multi-ejector stripping process parameters based on VCCT theory
摘要
Abstract
In order to prevent the chips from chipping during pickup,the virtual crack closure method was used to dynamically model and simulate the process of picking up chips in the multi-ejector pin process.First,the chip-adhesive layer-blue film composite model structure was established.Then the key parameters of the model were determined through the silicon wafer-blue film tensile experiments.Finally,the stress variation on the chip during the peeling process were analyzed by simulating different process parameters,including ejector pin spacing and adhesive layer materials.The simulation results indicate that the concentration of the stress occurs in the central area of the chip during peeling.Reducing the distance between ejector pins and the critical fracture energy of the adhesive layer can alleviate the stress concentration.The results provide the reference for the parameter selection of the multi-ejector pin pick-up chip process,which is helpful to improve the reliability of chip pick-up.关键词
多顶针工艺/虚拟裂纹闭合法/等效应力/临界断裂能Key words
multi-ejector process/virtual crack closure technique/equivalent stress/critical fracture energy分类
信息技术与安全科学引用本文复制引用
刘俐,杜松,张春华,刘胜,张适,陈志文..基于VCCT理论的芯片多顶针剥离工艺参数优化[J].电子元件与材料,2024,43(6):694-700,707,8.基金项目
国家重点研发计划(2022YFB3207100) （2022YFB3207100）
国家自然科学基金(62274122) （62274122）
国家自然科学基金(62004144) （62004144）
