电子元件与材料2024，Vol.43Issue(6)：721-728,8.DOI:10.14106/j.cnki.1001-2028.2024.1625
基于SIwave与Icepak的PCB板的电热耦合研究
Electro-thermal coupling of PCB based on SIwave and Icepak
蔡宇飞 1丁硕 1安轩毅 1陶源 1张宗卫1
作者信息
- 1. 中国民航大学 航空工程学院,天津 300300
- 折叠
摘要
Abstract
With the development of integrated circuits,a method was proposed to accurately simulate the temperature distribution of PCB in response to the increasing thermal design requirements.Using SIwave and Icepak software,the PCB and electronic components were modeled,then the bidirectional and unidirectional electro-thermal coupling simulation of the PCB were performed.By comparing the simulation and experimental results,the conclusions are as follows:The PCB temperature cloud map obtained by the simulation and experimental with infrared thermography demonstrates similar temperature distribution trends.Based on the bidirectional electro-thermal coupling simulation of PCB,the temperature distribution of PCB obtained by using the Re-k-ε turbulence model for the unidirectional electro-thermal coupling simulation is more accurate than that of the laminar flow model for the bidirectional electro-thermal coupling simulation.The simulation results were compared with the experimental results,and the maximum temperature difference is 2.59℃and the minimum is only 0.39℃.关键词
印制电路板/电热耦合/湍流模型/红外成像Key words
printed circuit board/electro-thermal coupling/turbulence model/infrared imaging分类
信息技术与安全科学引用本文复制引用
蔡宇飞,丁硕,安轩毅,陶源,张宗卫..基于SIwave与Icepak的PCB板的电热耦合研究[J].电子元件与材料,2024,43(6):721-728,8.
