基于SIwave与Icepak的PCB板的电热耦合研究OA北大核心CSTPCD

With the development of integrated circuits,a method was proposed to accurately simulate the temperature distribution of PCB in response to the increasing thermal design requirements.Using SIwave and Icepak software,the PCB and electronic components were modeled,then the bidirectional and unidirectional electro-thermal coupling simulation of the PCB were performed.By comparing the simulation and experimental results,the conclusions are as follows:The PCB temperature cloud map obtained by the simulation and experimental with infrared thermography demonstrates similar temperature distribution trends.Based on the bidirectional electro-thermal coupling simulation of PCB,the temperature distribution of PCB obtained by using the Re-k-ε turbulence model for the unidirectional electro-thermal coupling simulation is more accurate than that of the laminar flow model for the bidirectional electro-thermal coupling simulation.The simulation results were compared with the experimental results,and the maximum temperature difference is 2.59℃and the minimum is only 0.39℃.