|国家科技期刊平台
首页|期刊导航|光:科学与应用(英文版)|Silicon-photonics-enabled chip-based 3D printer

Silicon-photonics-enabled chip-based 3D printerOACSTPCD

Silicon-photonics-enabled chip-based 3D printer

英文摘要

Imagine if it were possible to create 3D objects in the palm of your hand within seconds using only a single photonic chip.Although 3D printing has revolutionized the way we create in nearly every aspect of modern society,current 3D printers rely on large and complex mechanical systems to enable layer-by-layer addition of material.This limits print speed,resolution,portability,form factor,and material complexity.Although there have been recent efforts in developing novel photocuring-based 3D printers that utilize light to transform matter from liquid resins to solid objects using advanced methods,they remain reliant on bulky and complex mechanical systems.To address these limitations,we combine the fields of silicon photonics and photochemistry to propose the first chip-based 3D printer.The proposed system consists of only a single millimeter-scale photonic chip without any moving parts that emits reconfigurable visible-light holograms up into a simple stationary resin well to enable non-mechanical 3D printing.Furthermore,we experimentally demonstrate a stereolithography-inspired proof-of-concept version of the chip-based 3D printer using a visible-light beam-steering integrated optical phased array and visible-light-curable resin,showing 3D printing using a chip-based system for the first time.This work demonstrates the first steps towards a highly-compact,portable,and low-cost solution for the next generation of 3D printers.

Sabrina Corsetti;Milica Notaros;Tal Sneh;Alex Stafford;Zachariah A.Page;Jelena Notaros

Research Laboratory of Electronics,Massachusetts Institute of Technology,Cambridge,MA 02139,USADepartment of Chemistry,The University of Texas at Austin,Austin,TX 78712,USA

《光:科学与应用(英文版)》 2024 (007)

1320-1330 / 11

This work was supported by the National Science Foundation Faculty Early Career Development(CAREER)Program(Grant No.2239525),Defense Advanced Research Projects Agency(DARPA)VIPER program(Grant No.FA8650-17-1-7713),Robert A.Welch Foundation(Grant No.F-2007),National Science Foundation Graduate Research Fellowship Program(Grant No.1122374),MIT Rolf G.Locher Endowed Fellowship,and MIT Frederick and Barbara Cronin Fellowship.The authors thank Dr.Manan Raval for contributions to prior work on the development and design of the integrated optical phased array,Andres Garcia Coleto for assistance with resin characterization experiments,Dr.Thomas Dyer and Dr.Christopher Baiocco for wafer fabrication,and Prof.Erich P.Ippen for thoughtful discussions and advice.

10.1038/s41377-024-01478-2

评论