现代制造工程Issue(7)：1-8,41,9.DOI:10.16731/j.cnki.1671-3133.2024.07.001
考虑黏接工艺对云纹干涉钻孔法标定系数基本机理的影响
Fundamental mechanism of calibration coefficients considering the effect of the bonding process on the moiré interference drilling method
摘要
Abstract
The incremental hole drilling technique that combines moiré interferometry with the hole drilling method is recognized as an effective method for measuring internal residual stress.The bonding agent used in this technique plays a crucial role in transferring strain from the structure's surface to the grating layer during the experimental process.However,the bonding agent's influence is often not considered when solving for the calibration coefficient.Utilizing finite element software,the effects of the bonding agent on the calibration coefficient were investigated by considering five factors:material properties of the bonding agent,the shape and size of the bonding agent,the thickness of the bonding agent,the increment of hole drilling,and the strain measure-ment method.The impact of the bonding agent was demonstrated by comparing the calibration coefficient error with and without considering the bonding agent.Based on the results,it can be concluded that neglecting the bonding agent's influence can signifi-cantly impact the calibration coefficient's accuracy.Excluding the bonding agent from the finite element model will lead to under-estimating the calibration coefficient.The error in the calibration coefficient exceeds 2.5％and is highly dependent on the drilling increment and the measurement method.Furthermore,the effect of bonding agents on thin-walled components is more significant than on thicker samples.关键词
增量钻孔法/云纹干涉法/黏接剂/残余应力/有限元模拟Key words
incremental hole drilling technique/moiré interferometry/bonding agent/residual stress/finite element simulation分类
矿业与冶金引用本文复制引用
张克明,曹宇,席尚宾,郑佩,张振亚,黄甲,刘文城,姚骏..考虑黏接工艺对云纹干涉钻孔法标定系数基本机理的影响[J].现代制造工程,2024,(7):1-8,41,9.基金项目
国家自然科学基金项目(11802316) （11802316）
国家商用飞机制造工程技术研究中心创新基金项目(COMAC-SFGS-2022-1874) （COMAC-SFGS-2022-1874）
常州市"龙城英才计划"项目(CQ20210045) （CQ20210045）
