电子与封装2024，Vol.24Issue(8)：1-15,15.DOI:10.16257/j.cnki.1681-1070.2024.0091
晶上系统:设计、集成及应用
System-on-Wafer:Design,Integration,and Applications
摘要
Abstract
System-on-wafer(SoW)is a wafer-level ultra large scale integration technology that has emerged in recent years.Multiple homogeneous or heterogeneous chips can be integrated on an entire wafer by SoW technology.With the interconnections on the wafer substrate,the chips can work collaboratively,which makes the SoW technology become an effective technical solution for further improving the performances of the electronic systems in the post Moore era.The main research progress of the SoW technology in recent years is summarized,and the key technologies such as system architecture,network topology,simulation modeling,power supply and heat dissipation are introduced.The development and application prospects of the SoW technology are also prospected.关键词
晶上系统/先进封装/晶圆级/异构集成/硅转接板Key words
system-on-wafer/advanced packaging/wafer-level/heterogeneous integration/silicon interposer分类
信息技术与安全科学引用本文复制引用
刘冠东,邓庆文,张汝云,王伟豪,万智泉,段元星,张坤,李洁,戚定定,王传智,李顺斌..晶上系统:设计、集成及应用[J].电子与封装,2024,24(8):1-15,15.基金项目
国家重点研发计划(2022YFB4401403) （2022YFB4401403）
之江实验室研究课题项目(2022QA0AL02) （2022QA0AL02）
之江实验室重大研究项目(2021LE0AC01) （2021LE0AC01）
