电子与封装2024，Vol.24Issue(8)：32-39,8.DOI:10.16257/j.cnki.1681-1070.2024.0093
铝焊盘镀钯铜丝多焊球脱焊失效的电化学评价
Electrochemical Evaluation of Multi-Ball Desoldering Failure with Palladium-Plated Copper Wire Solder Balls on Aluminum Pads
徐艳博 1王志杰 1刘美 1孙志美 1牛继勇1
作者信息
- 1. 恩智浦半导体(天津)有限公司,天津 300385
- 折叠
摘要
Abstract
Studying the failure process of multi-ball desoldering(MLB)of palladium-plated copper wire(PCC)solder joints on aluminum pads is essential to improve the reliability of products.The corrosion current of the electrode under different chloride ion concentrations,pH values and copper exposure areas is measured by electrochemical method to characterize the corrosion rate of aluminum and its intermetallic compounds(IMCs).The results show that chloride ions can change the anode polarizability and thus affect the corrosion current.A change in pH value can change cathode polarizability,which affects the corrosion current.As the protective layer of copper wire,palladium forms corrosion couples with exposed copper surface under the condition of uneven distribution of plating or improper selection of parameters,resulting in aluminum and its IMCs becoming sacrificial anodes and being corroded.关键词
封装技术/多焊球脱焊/镀钯铜丝/金属间化合物/电化学腐蚀/塔菲尔曲线Key words
packaging technology/multi-ball desoldering/palladium-plated copper wire/intermetallic compound/electrochemical corrosion/Tafel curve分类
信息技术与安全科学引用本文复制引用
徐艳博,王志杰,刘美,孙志美,牛继勇..铝焊盘镀钯铜丝多焊球脱焊失效的电化学评价[J].电子与封装,2024,24(8):32-39,8.
