电子与封装2024，Vol.24Issue(8)：40-46,7.DOI:10.16257/j.cnki.1681-1070.2024.0095
PBGA焊点形态对疲劳寿命的影响
Effect of PBGA Solder Joint Morphology on Fatigue Life
摘要
Abstract
The solder joint morphology of plastic ball grid array(PBGA)is predicted by Surface Evolver software,the results of the solder joint morphology are imported into Ansys software to conduct thermal cycling simulation experiments from-55 ℃ to 125 ℃,and the solder joint life is predicted by Coffin-Masson model.The three factors and three levels of orthogonal experiments are carried out by selecting the amount of brazing material in the solder joint,the height of the solder joint,and the diameter of the lower pad as the main factors affecting the life of the solder joint,and the most sensitive factor affecting the life of the bump and the optimal combination of morphology and size are obtained through the mean-response analysis.The results show that the most influential factor on the life of the solder joint is the lower pad radius,followed by the amount of solder,and finally the height of the solder joint.Additionally,the upper and lower pads of equal size have better reliability.关键词
Surface Evolver/塑料球栅阵列/焊点形态预测/热循环/疲劳寿命/封装技术Key words
Surface Evolver/plastic ball grid array/solder joint morphology prediction/thermal cycling/fatigue life/packaging technology分类
矿业与冶金引用本文复制引用
张威,刘坤鹏,张沄渲,于沐瀛,王尚,田艳红..PBGA焊点形态对疲劳寿命的影响[J].电子与封装,2024,24(8):40-46,7.基金项目
国家自然科学基金叶企孙联合基金(U2241223) （U2241223）
