电子与封装2024，Vol.24Issue(8)：47-50,4.DOI:10.16257/j.cnki.1681-1070.2024.0100
混合集成电路元器件的黏接渗胶问题研究
Study on Adhesive Penetration of Hybrid Integrated Circuit Components
韩文静 1冯春苗 1刘发 1袁海1
作者信息
- 1. 西安微电子技术研究所,西安 710119
- 折叠
摘要
Abstract
Hybrid integrated circuits realize the connection between components and substrates through adhesives.However,there is a problem of adhesive penetration during the process,whereby the relevant constituents of the adhesive overflow to the bonding area of the lead frame,resulting in the bonding strength of the bonded wires decreasing or failing to bond,thereby causing circuit connection problem.The adhesive penetration problem of thick film multilayer substrate and white ceramic substrate in the bonding process is studied,the correlation law between the phenomenon of adhesive penetration and the flux remaining in the gas phase cleaning solution is revealed,and an effective technological measure is proposed to improve the degree of adhesive penetration,so as to solve the adhesive penetration problem in the bonding process of hybrid integrated circuits.关键词
封装技术/黏接剂/渗胶/气相清洗/真空烘烤Key words
packaging technology/adhesive/adhesive penetration/gas phase cleaning/vacuum baking分类
信息技术与安全科学引用本文复制引用
韩文静,冯春苗,刘发,袁海..混合集成电路元器件的黏接渗胶问题研究[J].电子与封装,2024,24(8):47-50,4.
