电子与封装2024，Vol.24Issue(8)：51-57,7.DOI:10.16257/j.cnki.1681-1070.2024.0103
基于能量最小化的CCGA焊点形态仿真研究
Simulation Study on CCGA Solder Joint Morphology Based on Energy Minimization
摘要
Abstract
In order to determine the range of process parameter combinations for a ceramic column grid array(CCGA)device to achieve high soldering reliability,and study the variation of solder joint morphology with different parameters,the wetting angle of brazing filler metal,the volume of brazing filler metal and the offset of soldering column are taken as the key variables,Surface Evolver software based on the principle of energy minimization is used to calculate the actual morphology of solder joints under different combination of factors,and the parametric modeling process is introduced in detail.By comparing the morphology result with the acceptable standards of the solder joints,the range of parameters that can generate the qualified solder joints is found,and the reasonable process guidance for the actual production process of the solder joint micro-connections is provided.关键词
封装技术/Surface Evolver/焊点形态/CCGAKey words
packaging technology/Surface Evolver/solder joint morphology/CCGA分类
信息技术与安全科学引用本文复制引用
张威,刘坤鹏,王宏,杭春进,王尚,田艳红..基于能量最小化的CCGA焊点形态仿真研究[J].电子与封装,2024,24(8):51-57,7.基金项目
国家自然科学基金"叶企孙"联合基金(U2241223) （U2241223）
