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防护服用供气背包制冷装置结构设计与性能试验OA北大核心CSTPCD

Structural design and performance experiment of the refrigeration device for protective clothing air supply backpack

中文摘要英文摘要

针对防护服在高温、闷热等环境中出现舒适性差的问题,设计一款防护服用制冷式供气背包,并开展系列性能试验.通过半导体制冷装置试验,分别对比导冷型材材质及不同底板厚、散热型材不同尺寸和底板厚对制冷性能的影响.搭建集成式制冷装置,分别研究U形与直线型2种风道结构、制冷片开启数量和位置及环境温度等参数对制冷性能的影响.结果表明,在满足穿戴者基本供风量的前提下,U形风道结构制冷性能较好;开启4个制冷片,温度可降低13.2℃左右;开启2个制冷片时,靠近出风口侧上、下2个制冷片的制冷性能较好,温度可降低8.4℃左右;而环境温度主要影响制冷装置的散热性能,进而影响半导体制冷片的冷热交换.研究内容可为半导体制冷技术在防护服应用提供一定的参考.

To address the issue of poor comfort of protective clothing in high temperature,stuffy and other environments,a refrigerated air supply backpack for protective clothing was designed and the performance experiments were conducted.The effects of the material and bottom plate thickness of the cooling profile,the size and bottom plate thickness of the heat dissipation profile on the refrigeration performance were compared by the experiment of the semiconductor refrigeration device.An integrated refrigeration device was built to study the influences of the structure of U-shape and linear air duct,the amount and position of refrigeration plate,and the different environmental temperatures on the refrigeration performance,respectively.The results show that,while meeting the basic air supply needs of the wearer,the U-shape air duct structure has better refrigeration performance.The temperature can be reduced by about 13.2℃when opening four refrigeration chips.When two refrigeration chips are opened,the refrigeration performance of the upper and lower refrigeration chips near the air outlet side is better,which can reduce the temperature by about 8.4℃.The environmental temperature mainly affects the heat dissipation performance of the refrigeration device,and then affects the cold and heat exchange of semiconductor cooler.The research content provides some reference for the application of semiconductor refrigeration technology in protective clothing.

李希萌;索槐;任建强;李岳;蔡庆明;侯雨雷;曾达幸

燕山大学 机械工程学院,河北秦皇岛 066000秦皇岛嘎哈医疗电子仪器有限公司,河北秦皇岛 066300东莞理工学院 机械工程学院,广东东莞 523808

机械工程

半导体制冷供气背包制冷装置制冷性能

semiconductor refrigerationair supply backpackrefrigeration devicerefrigeration performance

《流体机械》 2024 (008)

1-7 / 7

河北省重点研发计划项目(23317701D);广东省基础与应用基础研究基金自然科学基金(2023A1515012103);广东高校科研平台和项目-创新团队项目(自科)(2022KCXTD033)

10.3969/j.issn.1005-0329.2024.08.001

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