基于压电喷墨技术3D打印纳米银墨水的固化工艺研究OA北大核心CSTPCD

In order to enhance the electrical performance of 3D inkjet-printed nano-silver ink,the effects of hot platform curing,near-infrared(NIR)curing,and photothermal coupling curing on the microstructure and conductivity of 3D inkjet-printed nano-silver ink were investigated.The results indicated that the resistivity of nano-silver films decreased with increasing curing time and temperature,99 µΩ·cm was achieved at the curing time of 25 min and curing temperature of 140℃.NIR curing at the power of 1000 W for 4 min reduced the resistivity to 33.2 μΩ·cm.Notably,during photothermal coupling curing,the electrical resistivity of the nanosilver film decreases with increasing scanning power and curing time.Under the conditions of substrate heating temperature of 160 ℃,scanning power of 1000 W and curing duration of 60 s,the lowest resistivity was 3.75 μΩ·cm.Additionally,the growth rate of the sintering necks during photothermal coupling curing was significantly faster than that of the thermal and photonic curing methods.