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首页|期刊导航|电子元件与材料|基于压电喷墨技术3D打印纳米银墨水的固化工艺研究

基于压电喷墨技术3D打印纳米银墨水的固化工艺研究

李超 林枝城 张义超 吕景祥

电子元件与材料2024,Vol.43Issue(7):853-859,7.
电子元件与材料2024,Vol.43Issue(7):853-859,7.DOI:10.14106/j.cnki.1001-2028.2024.0071

基于压电喷墨技术3D打印纳米银墨水的固化工艺研究

Curing process of 3D printing nano-silver ink based on piezoelectric inkjet technology

李超 1林枝城 2张义超 2吕景祥2

作者信息

  • 1. 中国电子科技集团公司第二十研究所,陕西西安 710068||西安瑞特三维科技有限公司,陕西西安 710068
  • 2. 长安大学工程机械学院,陕西西安 710064
  • 折叠

摘要

Abstract

In order to enhance the electrical performance of 3D inkjet-printed nano-silver ink,the effects of hot platform curing,near-infrared(NIR)curing,and photothermal coupling curing on the microstructure and conductivity of 3D inkjet-printed nano-silver ink were investigated.The results indicated that the resistivity of nano-silver films decreased with increasing curing time and temperature,99 µΩ·cm was achieved at the curing time of 25 min and curing temperature of 140℃.NIR curing at the power of 1000 W for 4 min reduced the resistivity to 33.2 μΩ·cm.Notably,during photothermal coupling curing,the electrical resistivity of the nanosilver film decreases with increasing scanning power and curing time.Under the conditions of substrate heating temperature of 160 ℃,scanning power of 1000 W and curing duration of 60 s,the lowest resistivity was 3.75 μΩ·cm.Additionally,the growth rate of the sintering necks during photothermal coupling curing was significantly faster than that of the thermal and photonic curing methods.

关键词

喷墨打印/增材制造/固化工艺/纳米银

Key words

ink jet printing/additive manufacturing/curing process/nano-silver

分类

电子信息工程

引用本文复制引用

李超,林枝城,张义超,吕景祥..基于压电喷墨技术3D打印纳米银墨水的固化工艺研究[J].电子元件与材料,2024,43(7):853-859,7.

基金项目

国家重点研发计划项目(2022YFB4602800) (2022YFB4602800)

电子元件与材料

OA北大核心CSTPCD

1001-2028

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