宇航材料工艺2024，Vol.54Issue(4)：81-86,6.DOI:10.12044/j.issn.1007-2330.2024.04.012
PI基材磁控溅射法制备柔性覆铜板的结合力优化研究
Research on the Optimization of Adhesion of Flexible Copper Clad Laminates Prepared by Magnetron Sputtering Method on PI Substrate
摘要
Abstract
The deposition of copper layers on polyimide films by magnetron sputtering is widely used in the preparation of flexible copper-clad laminates.At present,low bonding strength between the surface copper film and the polyimide substrate is one of the main problems faced by the magnetron sputtering method in the preparation of flexible copper-clad laminates.This paper proposes to improve the adhesion of copper film on the surface by plasma etching treatment of polyimide substrate and introducing a metal Cr bonding layer.It also compares and studies the effects of different plasma etching and metal Cr layers on the microstructure,density,resistivity,and adhesion of the surface copper film.The results show that plasma etching increases the surface roughness and surface energy of polyimide,which is beneficial for copper film deposition and forms mechanical interlocking and chemical bonds at the interface to improve adhesion.The Cr metal intermediate layer can form a solid solution at the film interface to strengthen the adhesion,reaching the optimal 5B level.This study is of great significance in solving the problem of poor adhesion between copper film and polyimide substrate in the preparation of flexible copper-clad laminates by magnetron sputtering.关键词
聚酰亚胺/铜膜/结合力/FCCLKey words
Polyimide/Copper film/Adhesion/FCCL分类
数理科学引用本文复制引用
王恩泽,王顺花,尚伦霖,张广安..PI基材磁控溅射法制备柔性覆铜板的结合力优化研究[J].宇航材料工艺,2024,54(4):81-86,6.基金项目
中国科学院科技服务网络计划(No.20201600200092) （No.20201600200092）
