电子与封装2024，Vol.24Issue(11)：27-32,6.DOI:10.16257/j.cnki.1681-1070.2024.0156
嵌入合金框架的扇出型板级封装结构及其翘曲仿真分析
Fan-Out Panel-Level Packaging Structure with Embedded Alloy Frame and Its Warpage Simulation Analysis
摘要
Abstract
Fan-out panel-level packaging(FOPLP)relies on its advantages of small wire width/spacing,high integration density,and small size to form an optimal solution for integrated circuits from a packaging perspective,achieving the continuation of Moore's Law.To address the warpage and reliability problems caused by the large size of FOPLP,a TC4 titanium alloy frame is proposed to be embedded in the packaging carrier board,and the influence of size parameters of the TC4 titanium alloy frame on the warpage is studied.The influence of length,width and thickness of TC4 titanium alloy frame on packaging warpage is evaluated by finite element simulation analysis method.With the increase of the size parameters of TC4 titanium alloy frame,the warpages of the packaging are reduced.In addition,the interaction effect of dimension parameters on warpage is analyzed by orthogonal analysis experiment,and the optimal window of key parameters is obtained.The warpage results obtained by measuring the product using shadow moiré method show good consistency with the simulation results.关键词
扇出型板级封装/翘曲变形/有限元仿真/阴影云纹法Key words
fan-out panel-level packaging/warpage deformation/finite element simulation/shadow moiré method分类
信息技术与安全科学引用本文复制引用
余胜涛,笪贤豪,何伟伟,彭琳峰,王文哲,杨冠南,崔成强..嵌入合金框架的扇出型板级封装结构及其翘曲仿真分析[J].电子与封装,2024,24(11):27-32,6.基金项目
国家自然科学基金(62204063) （62204063）
