电子与封装2024，Vol.24Issue(11)：41-47,7.DOI:10.16257/j.cnki.1681-1070.2024.0158
芯片焊盘加固提升Au-Al键合可靠性研究
Research on Improving Au-Al Bonding Reliability by Chip Pad Reinforcement
王亚飞 1杨鲁东 1吴雷 1李宏1
作者信息
- 1. 北京七星华创微电子有限责任公司,北京 101200
- 折叠
摘要
Abstract
Cu/Ni/Au bump is prepared on the surface of the aluminum pad of the chip to strengthen the chip pad,the problems of small process window and long-term reliability of gold-aluminum bonding in conventional chip aluminum pad are solved by optimizing the structure of the pad.The strength of the chip is greatly improved after pad reinforcement,which effectively avoids short-circuit problem caused by the breakdown of the dielectric layer under the pad during bonding.It is proved by experiments that the process window of wire bonding can be greatly improved by pad reinforcement,and the interface organization after pad reinforcement remains highly stable in a high-temperature storage test at 300 ℃ and 24 h.关键词
引线键合/金属间化合物/焊盘加固/凸块/可靠性/封装技术Key words
wire bonding/intermetallic compound/pad reinforcement/bump/reliability/packaging technology分类
信息技术与安全科学引用本文复制引用
王亚飞,杨鲁东,吴雷,李宏..芯片焊盘加固提升Au-Al键合可靠性研究[J].电子与封装,2024,24(11):41-47,7.
