摘要
Abstract
To deal with the demanding thermal reliability needs of the consumer electronics side,the melting characteristics,microstructures,and mechanical properties of Sn-3.0Ag-0.5Cu,Sn-1Ag-0.7Cu-3Bi-1.5Sb-12In,Sn-1Ag-0.7Cu-3Bi-1.5Sb-17In and Sn-20In-2.8Ag solders are investigated under isothermal aging conditions at 170 ℃ for different thermal aging times(0 h,1 000 h,2 000 h).It is found that In doping decreases the solid phase,liquid phase and peak temperatures while increasing the melting range.When the mass fraction of In exceeds 12％,the γ-InSn4 phase appears in the matrix,and a biphasic matrix appears in the solder joint.The addition of In transforms the solder/copper interface IMC from Cu6Sn5 to Cu6(Sn,In)5.During isothermal aging,the addition of In promotes the growth of Cu6(Sn,In)5 but inhibits the growth of Cu3(In,Sn).During the aging process,12In/Cu joint has the best shear properties,with high shear force and excellent shear strength.It holds practical significance for controlling the growth of interface compounds,exploring the impact of high In element doping on solder joint performance,and stabilizing solder joint structures.关键词
电子封装材料/In掺杂/热时效/剪切行为/微观结构Key words
electronic packaging materials/In doping/thermal aging/shear behavior/microstructural分类
信息技术与安全科学
