电子与封装2024，Vol.24Issue(12)：14-24,11.DOI:10.16257/j.cnki.1681-1070.2024.0162
基于SVR数据驱动模型的SiC功率器件关键互连结构热疲劳寿命预测研究
Research on Thermal Fatigue Life Prediction of Key Interconnect Structures of SiC Power Devices Based on SVR Data-Driven Model
摘要
Abstract
Interconnect reliability of sintered nano silver is critical for SiC modules.With the deepening of the cross-research between artificial intelligence and packaging reliability,the development of data-driven interconnection reliability evaluation methods has become one of the forefront issues in this field.Taking the typical SiC interconnect structure as the research object,the thermal fatigue life is used as the evaluation index,and the key factors such as chip size,sintered nano silver layer size and mechanical parameters are comprehensively studied,a data-driven prediction model for thermal fatigue life of sintered nano silver based on support vector regression(SVR)model is constructed,and the proposed data-driven model is quantitatively examined and verified comprehensively.By studying the correlation matrix of key interconnect parameters,it is found that increasing the thickness of sintered silver layer can improve the life of interconnect structure,and the elastic modulus of sintered silver layer and the thickness of SiC chip have adverse effects on the interconnect reliability.The research results can be used to guide the optimization design of SiC interconnect layer.关键词
封装技术/功率模块/烧结纳米银/疲劳寿命/机器学习Key words
packaging technology/power module/sintered nano silver/fatigue life/machine learning分类
信息技术与安全科学引用本文复制引用
于鹏举,代岩伟,秦飞..基于SVR数据驱动模型的SiC功率器件关键互连结构热疲劳寿命预测研究[J].电子与封装,2024,24(12):14-24,11.基金项目
国家自然科学基金(12272012) （12272012）
