电子与封装2024，Vol.24Issue(12)：32-37,6.DOI:10.16257/j.cnki.1681-1070.2024.0171
基于田口法的高热可靠性DFN封装最优结构参数仿真研究
Simulation Study on Optimal Structural Parameters of High Thermal Reliability DFN Package Based on Taguchi Method
摘要
Abstract
With the continuous development of electronic technology,chips are increasingly developing towards the direction of system-level package,and the package industry has ushered in new challenges and opportunities.Package can provide mechanical support,electrical connection and heat dissipation for the chip,so its reliability research has attracted much attention.Dual flat no-lead(DFN)package is a leadless surface mount package technology.Unreasonable material combination or structural design can lead to warpage or stress concentration,which directly affects the coplanarity and reliability of the package,causing problems such as chip fracture and solder delamination.For typical DFN package structures,the warpage and stress of key parts of specific package products after reflow soldering and under thermal cycling loads are studied by finite element simulation.The DFN package design parameters are evaluated and optimized by Taguchi method to obtain the optimal combination of structural parameters.The optimal structural parameter combinations are compared with the actual product simulation results,the rationality of the simulation model is verified,and the theoretical guidance is provided for the actual production of high-reliability DFN package.关键词
DFN封装/翘曲/田口法优化/有限元仿真Key words
DFN package/warpage/Taguchi method optimization/finite element simulation分类
信息技术与安全科学引用本文复制引用
庞瑞阳,吴洁,王磊,邢卫兵,蔡志匡..基于田口法的高热可靠性DFN封装最优结构参数仿真研究[J].电子与封装,2024,24(12):32-37,6.基金项目
国家自然科学基金青年项目(52105369,52205436) （52105369,52205436）
江苏省先进集成电路封装与测试工程研究中心开放项目(NTIKFJJ202303,NTIKFJJ202302) （NTIKFJJ202303,NTIKFJJ202302）
