电子与封装2025，Vol.25Issue(3)：1-15,15.DOI:10.16257/j.cnki.1681-1070.2025.0046
功率器件封装用纳米铜焊膏及其烧结技术研究进展
Progress of Research on Nano Copper Solder Paste and Its Sintering Technology for Power Device Packaging
摘要
Abstract
Third-generation semiconductor as the core of the power electronics devices towards high power density and high junction temperature direction presents strict challenges to the package interconnect materials,processes and reliability under service conditions.Nano copper(Cu)solder paste has emerged as a kind of industrialization potential power device packaging candidate material owing to its low cost,electromigration resistance,and excellent electrical and thermal conductivity,along with the characteristic of"low-temperature sintering and high-temperature service",which has been closely concerned by the researchers.However,there is still a large gap between the stability(easy oxidation)and low-temperature sintering performance of nano-copper solder pastes compared to nano-silver(Ag)solder pastes.Based on the experimental results,the latest progress of nano-copper solder paste sintering technology is systematically described in terms of sintering mechanisms,sintering processes,performance behavior and service reliability of nano-copper sintered joints.Furthermore,in view of the shortcomings of the current nano-copper sintering technology,the subsequent development direction and research prospects are prospected.关键词
电子封装/第三代半导体/烧结/纳米铜/纳米铜焊膏/抗剪强度/可靠性Key words
electronic packaging/third-generation semiconductor/sintering/nano copper/nano copper solder paste/shear strength/reliability分类
金属材料引用本文复制引用
王秀琦,李一凡,罗子康,陆大世,计红军..功率器件封装用纳米铜焊膏及其烧结技术研究进展[J].电子与封装,2025,25(3):1-15,15.基金项目
国家自然科学基金(NSFC 51775140、NSFC 52232004) （NSFC 51775140、NSFC 52232004）
广东省重点领域研发计划(2019B010935001) （2019B010935001）
中央高校基本科研业务费(HIT.DZJJ.2023112) （HIT.DZJJ.2023112）
