电子与封装2025，Vol.25Issue(3)：16-24,9.DOI:10.16257/j.cnki.1681-1070.2025.0037
乙基纤维素影响下的微米银焊膏和纳米银焊膏烧结对比研究
Comparative Study on the Sintering of Ag Microparticles Solder Paste and Ag Nanoparticles Solder Paste Under the Influence of Ethyl Cellulose
摘要
Abstract
The Ag microparticles(Ag MPs)solder paste and the Ag nanoparticles(Ag NPs)solder paste are the most likely connection materials for high-temperature packaging due to their characteristics of low-temperature sintering and high-temperature service.The influence of ethyl cellulose on the sintering results of Ag MPs solder paste and Ag NPs solder paste is studied,and the reasons for the differences in sintering results between the 2 groups of solder pastes under the same conditions are analyzed.The results show that the sintering properties of the 2 groups of solder pastes are better with the addition of ethyl cellulose with a mass fraction of 5％under the conditions of no pressure,250 ℃,and air,the joint strength and film resistivity obtained by sintering of Ag MPs solder paste are 8.57 MPa and 4.25 μΩ·cm,and the joint strength and film resistivity obtained by sintering of Ag NPs solder paste are 32.89 MPa and 7.71 μΩ·cm.The microstructures of the joint interface and film show that the sintering neck formed between particles after sintering and the uniformity of sintered microstructure are key factors affecting the bonding strength,while the density of sintered microstructure is the main factor affecting the electrical conductivity.The research results provide a reference for further improving the strength of silver solder paste sintered joints and the electrical conductivity of the sintered film.关键词
乙基纤维素/微米银焊膏/纳米银焊膏/烧结性能Key words
ethyl cellulose/Ag microparticles solder paste/Ag nanoparticles solder paste/sintering property分类
电子信息工程引用本文复制引用
喻龙波,夏志东,邓文皓,林文良,周炜,郭福..乙基纤维素影响下的微米银焊膏和纳米银焊膏烧结对比研究[J].电子与封装,2025,25(3):16-24,9.基金项目
国家自然科学基金(61904008) （61904008）
