电子与封装2025，Vol.25Issue(3)：25-31,7.DOI:10.16257/j.cnki.1681-1070.2025.0042
烧结银阵列互连双面散热SiC半桥模块的散热和应力仿真
Heat Dissipation and Stress Simulation of Double-Sided Heat Dissipation SiC Half-Bridge Module with Sintered Silver Array Interconnection
摘要
Abstract
Based on the double-sided heat dissipation SiC half-bridge module with sintered silver as the chip interconnect layer,the shapes of sintered silver interconnect layer between the top surface of the chip and the substrate are changed into sheet,cylindrical array,and cuboid array,the heat dissipation and thermo-mechanical stress are simulated.The simulation results show that due to the high thermal conductivity of sintered-silver,shape change of sintered silver layer has little effect on the heat dissipation performance.Compared with that of the sheet sintered silver interconnection module,the junction temperatures of the modules with cylindrical array and cuboid array sintered silver interconnections are only increased by a maximum of 0.2 ℃ and 0.14 ℃.Due to the effective dispersion and relief of thermal stress through multiple small connection points in the sintered silver interconnect layer of the array model,the residual thermal stress and working thermal stress of cylindrical and cuboid arrays are significantly reduced.The sintering residual thermal stress and working thermal stress of cylindrical array model are reduced by 8.57％and 3.16％,and the sintering residual thermal stress and working thermal stress of cuboid array model are reduced by 8.57％and 37.71％.And the cost of sintered silver can be reduced by reducing the sintered silver area,which has certain scientific research value and application significance.关键词
双面散热模块封装/烧结银/阵列/散热/热应力Key words
double-sided heat dissipation module packaging/sintered silver/array/heat dissipation/thermal stress分类
电子信息工程引用本文复制引用
逄卓,赵海强,徐涛涛,张浩波,王美玉..烧结银阵列互连双面散热SiC半桥模块的散热和应力仿真[J].电子与封装,2025,25(3):25-31,7.基金项目
国家自然科学基金(52107198) （52107198）
广东省自然科学基金(2023A1515011854) （2023A1515011854）
南开大学中央高校基本科研业务费专项资金(63231154,63241330) （63231154,63241330）
