电子与封装2025，Vol.25Issue(3)：47-59,13.DOI:10.16257/j.cnki.1681-1070.2025.0056
功率模块封装用环氧树脂改性技术应用进展
Progress in the Application of Epoxy Resin Modification Technology for Power Module Package
摘要
Abstract
Epoxy resins are the first choice for power module package materials due to their excellent electrical insulation,mechanical strength and high temperature resistance.As the integration degree of power modules increases and the service environment becomes increasingly demanding,the performance requirements for epoxy resins continue to improve.The classification,modification and application of epoxy resins in the power module package are summarized,and the challenges faced by epoxy resins and their future development directions are pointed out.The modified epoxy resins can improve the thermal management capability,insulation performance,corrosion resistance and warping resistance of the power module package.Future research directions include the development of high temperature resistant packaging materials,the exploration of environmentally friendly and multi-functional epoxy resins,and the combination of new materials and new processes.关键词
环氧树脂/功率模块封装/改性技术/热管理能力/绝缘性能Key words
epoxy resin/power module package/modification technology/thermal management capability/insulation performance分类
电子信息工程引用本文复制引用
曹凤雷,贾强,王乙舒,刘若晨,郭福..功率模块封装用环氧树脂改性技术应用进展[J].电子与封装,2025,25(3):47-59,13.基金项目
重庆市自然科学基金(CSTB2023NSCQ-MSX0187) （CSTB2023NSCQ-MSX0187）
北京市自然科学基金-小米创新联合基金(L233038) （L233038）
