电子与封装2025，Vol.25Issue(3)：60-77,18.DOI:10.16257/j.cnki.1681-1070.2025.0058
功率器件封装纳米浆料材料与低温烧结工艺及机理研究进展
Advances in Nanopaste Materials and Low Temperature Sintering Process and Mechanism for Power Device Packaging
摘要
Abstract
With the development of materials for power electronic devices,third-generation wide-bandgap semiconductors(such as SiC and GaN)have emerged as ideal materials for power devices due to their remarkable performance.However,facing the challenges of high-power and high-temperature applications,traditional tin-based packaging materials have difficulties in meeting the requirements of high-power and high-temperature applications.As a result,researchers have begun to focus on nanosintered pastes that can be sintered at low temperatures and serve at high temperatures.These micro-and nano-scale copper and silver pastes can be sintered at temperatures well below the melting point of the metal to form solder joint structures with a high melting point,high thermal conductivity,and high performance.The research progress of sintered pastes for power device packaging in recent years is discussed from three aspects:sintering materials,sintering process,and sintering mechanism,specifically including nano Ag,nano Cu,Ag-Cu composites,and other nano-sized sintering materials,as well as their corresponding processes such as thermal pressure sintering,pressureless sintering,and thin-film sintering techniques,in order to provide references for the further development of sintering pastes.关键词
纳米浆料/烧结/功率器件/电子封装技术/烧结纳米铜Key words
nano paste/sinter/power device/electronics packaging technology/sinter nano Cu分类
电子信息工程引用本文复制引用
王一平,于铭涵,王润泽,佟子睿,冯佳运,田艳红..功率器件封装纳米浆料材料与低温烧结工艺及机理研究进展[J].电子与封装,2025,25(3):60-77,18.基金项目
国家自然科学基金(52205352) （52205352）
国家自然科学基金联合基金-"叶企孙"科学基金(U2241223) （U2241223）
