电子与封装2025，Vol.25Issue(3)：84-94,11.DOI:10.16257/j.cnki.1681-1070.2025.0082
高功率电子封装中大面积烧结技术研究进展
Research Progress on Large-Area Sintering Technology for High-Power Electronic Packaging
摘要
Abstract
Driven by wide bandgap semiconductor materials(such as silicon carbide and gallium nitride),large-area sintering technology has demonstrated promising prospects due to its unique advantages in high-power electronic packaging.The research progress of silver and copper as large-area sintering materials in power module packaging is reviewed.The definition standards of large-area sintering,material properties,process control methods,and their effects on joint performance are systematically analyzed.Optimization strategies of temperature,pressure,and surface treatment process during large-area sintering are discussed to enhance the density,thermal conductivity,and mechanical properties of the joints.Furthermore,future optimization directions are proposed to address the current challenges of large-area sintering technology.By summarizing the relevant research achievements at home and abroad,it offers theoretical guidance and practical references for the further development of large-area sintering technology in high-power electronic packaging.关键词
功率电子封装/大面积烧结/银烧结/铜烧结/烧结工艺/接头性能测试Key words
power electronic packaging/large-area sintering/silver sintering/copper sintering/sintering process/joint performance testing分类
电子信息工程引用本文复制引用
边乐陶,刘文婷,刘盼..高功率电子封装中大面积烧结技术研究进展[J].电子与封装,2025,25(3):84-94,11.基金项目
国家自然科学基金青年基金(62304051) （62304051）
上海市2024年度"科技创新行动计划"项目(24500790702) （24500790702）
上海碳化硅功率器件工程技术研究中心项目(19DZ2253400) （19DZ2253400）
