电子与封装2025，Vol.25Issue(3)：95-99,5.DOI:10.16257/j.cnki.1681-1070.2025.0083
表面贴装大功率器件热匹配问题可靠性仿真
Reliability Simulation of Thermal Matching Issues in Surface-Mounted High-Power Devices
摘要
Abstract
To address the thermomechanical mismatch problem caused by differences in the coefficient of thermal expansion between different materials in surface-mounted high-power devices,the lifetime and reliability of key interconnection structures are analyzed under different heating rates.The potential impact of material thermal expansion mismatches on device performance and long-term reliability is explored.The mechanical properties of SAC305 solder are investigated in detail through the Anand constitutive model,focusing on the stress-strain and temperature characteristics.The lifetime assessment is conducted based on the Coffin-Manson model,and the relationship between solder fatigue failure and plastic strain is systematically analyzed.The simulation results indicate that the larger the temperature change rate,the more obvious thermal-mechanical mismatch becomes,resulting in significant thermal stress and fatigue effects within the components,which leads to a decrease in their lifetime and reliability.关键词
表面贴装器件/Anand本构模型/Coffin-Manson模型/可靠性分析Key words
surface-mounted device/Anand constitutive model/Coffin-Manson model/reliability analysis分类
电子信息工程引用本文复制引用
胡运涛,苏昱太,刘灿宇,刘长清..表面贴装大功率器件热匹配问题可靠性仿真[J].电子与封装,2025,25(3):95-99,5.基金项目
陕西省科技厅秦创原创新创业人才项目(QCYRCXM-2022-306) （QCYRCXM-2022-306）
重庆市自然科学基金(CSTB2022NSCQ-MSX0574) （CSTB2022NSCQ-MSX0574）
国防重点实验室开放基金2022-JCJQ-LB-006(6142411232212) （6142411232212）
电子制造与封装集成湖北省重点实验室开放基金(EMPI2024002) （EMPI2024002）
