电子与封装2025，Vol.25Issue(3)：100-107,8.DOI:10.16257/j.cnki.1681-1070.2025.0047
纳米铜粉的制备方法及其在电子封装行业的应用
Preparation Methods of Nanometer Copper Powder and Its Applications in Electronic Packaging Industry
王一帆 1汪根深 1孙德旺 2陆冰沪 2章玮 2李明钢1
作者信息
- 1. 中南大学冶金与环境学院,长沙 410083
- 2. 安徽省有色金属新材料研究院,合肥 230601
- 折叠
摘要
Abstract
Nanometer copper powder can be used as the filler material of the paste to enable low-temperature sintering in the field of electronic packaging,replacing the higher-priced silver,which has a broad application prospect.The size,morphology and purity of nanometer copper powder are closely related to the preparation methods,and it is necessary to have an in-depth understanding of the different preparation methods to achieve precise control of particle size.Three mainstream preparation methods of nanometer copper powder are reviewed,and the low-cost liquid-phase reduction method is introduced in detail.The application of nanometer copper powder in low-temperature sintered copper paste is introduced,the influence of paste composition,sintering parameters and other factors on the sintering properties of copper paste is analyzed.The technical bottleneck and development trend of nanometer copper powder are pointed out,and the particle size,controllable morphology and antioxidant measures of nanometer copper powder will become research hotspots.关键词
纳米铜粉/液相还原法/铜烧结/电子封装Key words
nanometer copper powder/liquid phase reduction method/copper sintering/electronic packaging分类
电子信息工程引用本文复制引用
王一帆,汪根深,孙德旺,陆冰沪,章玮,李明钢..纳米铜粉的制备方法及其在电子封装行业的应用[J].电子与封装,2025,25(3):100-107,8.
