电子与封装2025，Vol.25Issue(3)：108-122,15.DOI:10.16257/j.cnki.1681-1070.2025.0091
大功率器件基板散热技术研究进展
Research Progress on Substrate Heat Dissipation Technology for High Power Devices
摘要
Abstract
Electronic devices are developing towards high performance and miniaturization,with the continuous improvement of frequency,power and integration,the heat generated by high power chips inside electronic increases rapidly,which not only affects the efficiency and stability of the devices,but also directly relates to the safety and reliability of the whole system.The heat generated by high power devices mainly relies on the channels provided by the package substrate to dissipate,so it is particularly important to study the substrate heat dissipation technology.The research status of heat dissipation technologies of conventional substrates such as metal substrates,ceramic substrates,composite substrates and new substrate heat dissipation technologies such as microfluidic heat dissipation technology,phase change heat dissipation technology and thermoelectric heat dissipation technology are introduced in detail.Among them,the manifold microchannel diamond substrate and multiple heat dissipation methods synergistically applied substrate have excellent cooling performance,which is expected to greatly improve the power and life of electronic devices.By analyzing various substrate heat dissipation technologies,it is expected to provide valuable references for research and applications in related fields.关键词
大功率器件/基板散热/冷却性能Key words
high power devices/substrate heat dissipation/cooling performance分类
信息技术与安全科学引用本文复制引用
兰梦伟,姬峰,王成伟,孙浩洋,杜建宇,徐晋宏,王晶,张鹏哲,王明伟..大功率器件基板散热技术研究进展[J].电子与封装,2025,25(3):108-122,15.基金项目
国家自然科学基金联合基金-"叶企孙"科学基金(U2141218) （U2141218）
