电子与封装2025，Vol.25Issue(4)：5-12,8.DOI:10.16257/j.cnki.1681-1070.2025.0032
基于AFM-IR的电子铜箔表面痕量有机物的原位检测与去除
In-Suit Detection and Removal of Trace Organics on the Surface of Electronic Copper Foils by AFM-IR
摘要
Abstract
High-performance electronic copper foil is one of the core raw materials for high-frequency and high-speed PCB used in new-generation communication technologies.The control of adsorbed organic additives on the surface after copper electrodeposition has an important influence on the performance of electronic copper foil.Based on the extremely high detection sensitivity and spatial resolution of the atomic force microscopy-based infrared spectroscopy(AFM-IR)technique,the trace organic additives remaining on the surface of domestic copper foil are detected in situ as the leveling agent gelatin,and analyzed by the copper foil surface chemical imaging,which reveals that these residual leveling agents are adsorbed in a sporadic manner on top and side of the passivation layer of the copper tumors.The efficiency of dichloromethane solvent washing to remove residual trace organic impurities remaining on the surface of copper foils is quantitatively analyzed under the monitoring of AFM-IR method.The related work will contribute to the optimization of the surface treatment process of copper foil and the realization of high performance of domestic electronic copper foil.关键词
原子力显微-红外光谱/铜箔/痕量有机物检测/表面处理/PCBKey words
atomic force microscopy-based infrared spectroscopy/copper foil/detection of trace organic/surface treatment/PCB分类
化学引用本文复制引用
李林玲,周东山,薛奇,王勇,印大维,章晨,滕超,陈葳,江伟,李大双,郑小伟..基于AFM-IR的电子铜箔表面痕量有机物的原位检测与去除[J].电子与封装,2025,25(4):5-12,8.基金项目
国家自然科学基金原创探索计划(52350346) （52350346）
广东省普通高校工程技术中心项目(2023GCZX015) （2023GCZX015）
