电子与封装2025，Vol.25Issue(4)：18-23,6.DOI:10.16257/j.cnki.1681-1070.2025.0036
SO-8塑封器件湿热耦合可靠性研究
Research on the Reliability of Hygrothermal Coupling of SO-8 Plastic-Encapsulated Devices
李登科1
作者信息
- 1. 中国空空导弹研究院,河南洛阳 471009
- 折叠
摘要
Abstract
With the large-scale application of plastic-encapsulated devices in various electronic products,research on their reliability has gradually become a focal point.The hygroscopic properties of encapsulation materials make plastic-encapsulated devices highly sensitive to moisture,thus making the study of hygrothermal characteristics of plastic-encapsulated devices particularly valuable.Based on ANSYS Workbench finite element software,a high-pressure steam test simulation is conducted on the SO-8 plastic-encapsulated device.The stress and strain distributions in each structure of the device under hygrothermal coupling test conditions are analyzed.The simulation results indicate that significant stress and strain occur at the contact points between various internal structures of the SO-8 plastic-encapsulated device,with the large stresses and strains observed at the interface between the lead frame and the encapsulation material.These areas are prone to delamination in the plastic-encapsulated device.Combined with the ultrasonic scanning image of the SO-8 plastic-encapsulated device after the high-pressure steam test,it is found that the delamination of the SO-8 plastic-encapsulated device mainly occurs on the lead frame under hygrothermal coupling conditions,and this phenomenon is consistent with the finite element simulation results,which provides important references for the design and packaging of SO-8 plastic-encapsulated devices.关键词
塑封器件/湿热耦合/有限元仿真/可靠性Key words
plastic-encapsulated device/hygrothermal coupling/finite element simulation/reliability分类
电子信息工程引用本文复制引用
李登科..SO-8塑封器件湿热耦合可靠性研究[J].电子与封装,2025,25(4):18-23,6.
