电子与封装2025，Vol.25Issue(4)：48-51,4.DOI:10.16257/j.cnki.1681-1070.2025.0044
基于SiP应用的多层有机复合基板的三维堆叠
Three-Dimensional Stacking of Multilayer Organic Composite Substrates Based on SiP Applications
姚剑平 1李庆东 1管慧娟 1杨先国 1苟明艺1
作者信息
- 1. 成都西科微波通讯有限公司,成都 610091
- 折叠
摘要
Abstract
In order to further realize the design,production and application of radio frequency microwave products in miniaturization,generalization and serialization,a three-dimensional stacking integrated package design method and a process realization method based on multilayer organic composite substrate are proposed and applied to a frequency-tunable system-in-package(SiP)component.Compared with two-dimensional high-density integration,the three-dimensional stacking integrated package based on multilayer organic composite substrate enhances the space utilization in the vertical direction and can further realize the miniaturization of radio frequency products.The simulation and test results of the three-dimensional stacking model of multilayer organic composite substrate show that the structural model can meet the requirements for wideband radio frequency signal transmission.The performance of the frequency-tunable SiP component designed by three-dimensional stacking of multilayer organic composite substrates meets the requirements of the index,and the design method and the process realization method are feasible.关键词
三维堆叠/系统级封装/球栅阵列/小型化Key words
three-dimensional stacking/system-in-package/ball grid array/miniaturization分类
信息技术与安全科学引用本文复制引用
姚剑平,李庆东,管慧娟,杨先国,苟明艺..基于SiP应用的多层有机复合基板的三维堆叠[J].电子与封装,2025,25(4):48-51,4.
