电子与封装2025，Vol.25Issue(5)：1-13,13.DOI:10.16257/j.cnki.1681-1070.2025.0069
混合键合界面接触电阻及界面热阻研究进展
Research Progress on Interfacial Contact Resistance and Interfacial Thermal Resistance of Hybrid Bonding
摘要
Abstract
As semiconductor technology advances towards higher levels of integration and performance,hybrid bonding technology has shown great potential in the field of integrated circuits as an advanced packaging method.The research progress on interfacial contact resistance and interfacial thermal resistance in hybrid bonding is reviewed,and its application in 3D integrated chips is discussed,with a focus on the technological breakthroughs in reducing resistance and optimizing thermal resistance.The key factors influencing interfacial resistance and thermal resistance are summarized,and the impact of various processes on performance is evaluated.The significant impacts of interfacial treatment,surface roughness,cleaning time,and annealing on contact resistance are investigated,and the important role of interfacial materials and multi-physical field coupling effects in optimizing thermal resistance is analyzed.Furthermore,the advancement of fine-pitch hybrid bonding technology has driven the increase in chip packaging density,but as the pitch continues to shrink,issues such as interfacial stress and alignment errors still need to be further addressed.关键词
先进封装/高密度互连/接触电阻/界面热阻/开尔文结构Key words
advanced packaging/high density interconnection/contact resistance/interfacial thermal resistance/Kelvin structure分类
电子信息工程引用本文复制引用
吴艺雄,杜韵辉,陶泽明,钟毅,于大全..混合键合界面接触电阻及界面热阻研究进展[J].电子与封装,2025,25(5):1-13,13.基金项目
国家自然科学基金(62474146、62104206) （62474146、62104206）
中央高校基本科研业务费专项资金(20720220072) （20720220072）
