电子与封装2025，Vol.25Issue(5)：14-27,14.DOI:10.16257/j.cnki.1681-1070.2025.0074
面向高密度互连的混合键合技术研究进展
Research Progress of Hybrid Bonding Technology for High-Density Interconnects
摘要
Abstract
In the era of the digital economy,the rapid advancement of emerging industries,such as artificial intelligence,high-performance computing,big data,Internet of Things,and autonomous driving,has placed an extremely high demand on computational power.However,as advanced processes approach physical limits and Moore's Law has slowed down significantly,traditional wire bonding technology is no longer capable of meeting the computational demand of high-performance chips in the digital economy.Against this backdrop,3D integration technology has emerged as a transformative solution.As a cornerstone of 3D integration technology,hybrid bonding enables bumpless high-density interconnections through the direct bonding of metal-to-metal layers and dielectric-to-dielectric layers.Compared with conventional bonding technology,hybrid bonding not only achieves sub-micron or even nanometer-scale interconnect pitches,but also significantly reduces signal delay and power consumption,thereby enhancing chip bandwidth and capacity,and providing key support for the realization of high-performance chips.In the post-Moore era,hybrid bonding is regarded as a core development direction in advanced packaging,offering narrow-pitch,high-density,and miniaturized interconnect structures to meet the stringent performance requirements of emerging applications on chip performance.Hybrid bonding technology for high-density interconnects is systematically introduced,focusing on the novel metal passivation layer and other key materials as well as the core processes employed.The current status and development trend of hybrid bonding technology in the field of high-bandwidth memory are discussed in depth,aiming to provide valuable insights and guidance for the continuous innovation and evolution of advanced packaging technologies.关键词
混合键合/高密度互连/三维集成/高带宽内存Key words
hybrid bonding/high-density interconnect/3D integration/high-bandwidth memory分类
电子信息工程引用本文复制引用
白玉斐,戚晓芸,牛帆帆,康秋实,杨佳,王晨曦..面向高密度互连的混合键合技术研究进展[J].电子与封装,2025,25(5):14-27,14.基金项目
国家自然科学基金重大研究计划(92164105) （92164105）
黑龙江省"头雁"团队(HITTY-20190013) （HITTY-20190013）
材料结构精密焊接与连接全国重点实验室自主课题(24-T-04) （24-T-04）
