电子与封装2025，Vol.25Issue(5)：43-54,12.DOI:10.16257/j.cnki.1681-1070.2025.0084
面向PCB应用的超薄铜箔电镀制备研究进展
Research Progress of Ultra-Thin Copper Foil Electroplating Preparation for PCB Applications
高子泓 1刘志权 2李财富1
作者信息
- 1. 中山大学材料学院,广东 深圳 518107
- 2. 中国科学院深圳先进技术研究院,广东 深圳 518055||南方科技大学半导体学院(国家卓越工程师学院),广东 深圳 518055
- 折叠
摘要
Abstract
Electroplating copper foil is one of the core materials of PCBs,and has gained significant attention.With the development of modern electronic products in the direction of multifunctionality,lightweight,compactness and thinness,it is difficult for traditional PCB manufacturing technology to meet the new technical standards in the fabrication of fine interconnection lines.Using the modified semi-additive process with ultra-thin copper foil(＜5 μm)as the core material,the interconnect circuits with smaller and narrower line width/spacing(≤30 μm/30 μm)can be prepared.How to prepare high-performance ultra-thin copper foil with a thickness below 5 μm is currently an urgent problem in the electronic manufacturing industry.The application methods of ultra-thin copper foil in PCBs are summarized.The influences of process parameters,cathode substrates,and plating bath compositions on the electrodeposition behavior,microstructure,and properties of copper foil are discussed.The strategies of existing electroplating methods for regulating the microstructure and property of ultra-thin copper foil are reviewed,and the future development trends and research directions for producing ultra-thin copper foil by the electroplating methods are prospected.关键词
铜互连/电镀工艺/超薄铜箔/微观结构Key words
copper interconnection/electroplating process/ultra-thin copper foil/microstructure分类
电子信息工程引用本文复制引用
高子泓,刘志权,李财富..面向PCB应用的超薄铜箔电镀制备研究进展[J].电子与封装,2025,25(5):43-54,12.
